WAKEFIELD SOLUTIONS 655-26AB 散热器, 40.6 X 6.6 X 40.6MM, BGA
散热片 分类(BGA,LGA,CPU,ASIC……) 铝 5.0W @ 60°C 顶部安装
得捷:
HEATSINK FOR 40MM BGA
e络盟:
WAKEFIELD SOLUTIONS 655-26AB 散热器, 40.6 X 6.6 X 40.6MM, BGA
Allied Electronics:
Omnidirectional Pin Fin Heat Sink for 40mm BGA & Power PC
Verical:
Heat Sink Passive BGA Pin Array Black Anodized
Newark:
# WAKEFIELD SOLUTIONS 655-26AB Heat Sink, Square, For Ball Grid Arrays, BGA, 6.6 mm, 40.6 mm, 40.6 mm
MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized