WAKEFIELD SOLUTIONS 660-29AB 散热器, 38.9MMX7.2MM
散热片 BGA 铝 2.0W @ 30°C 顶部安装
得捷:
HEATSINK EXTRUSION 37MM
e络盟:
散热器, 38.9MMX7.2MM
Allied Electronics:
Unidirectional Fin Heat Sink for 37mm BGA
Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Verical:
Heat Sink Passive BGA Pin Array Black Anodized
Newark:
# WAKEFIELD SOLUTIONS 660-29AB Heat Sink, For Ball Grid Array, BGA, 7.2 mm, 38.9 mm, 38.9 mm
MASTER:
Heat Sink Passive BGA Pin Array Black Anodized
Electro Sonic:
Heat Sink Passive BGA Pin Array Black Anodized