630-25AB概述
HEAT SINK; Packages Cooled: BGA; Width: 35mm; Height: 6.4mm; Heat Sink Material: Aluminum; Length: 35mm
散热片 BGA 铝 - 顶部安装
得捷:
HEATSINK FOR 35MM BGA
Newark:
# WAKEFIELD SOLUTIONS 630-25AB Heat Sink, Square, For Ball Grid Arrays, Omnidirectional, Pin Fin, BGA, 6.4 mm, 35 mm, 35 mm
在线购买630-25AB
型号： 630-25AB
制造商：
Wakefield Engineering
描述：HEAT SINK; Packages Cooled: BGA; Width: 35mm; Height: 6.4mm; Heat Sink Material: Aluminum; Length: 35mm