2.00毫米（ 0.079 ）间距VHDM®板对板背板头，垂直， 8排，导针信号模块，盾尾版，针端版本， 200电路 2.00mm .079 Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits
VHDM® Backplane Connectors and Cable Assemblies
Achieve high-speed signal integrity via ’s VHDM ® backplane connector and cable assembly system through high-density and high-speed performance utilizing the differential pair architecture ideal for datacom, telecom, testing and military applications. VHDM connectors and cable assemblies are available in 6- and 8-row configurations supporting data rates of 3.125 Gbps with less than 5% crosstalk. Individual wafers incorporate the signal pins and stripline shielding to allow 100% of the signal pins to be used for signal transmission. The grid of the mating face is 2.00mm between columns and 2.25mm between rows.
The daughter card connectors are made from wafers. Each wafer has a column of signal contacts plus a ground shield, which are then mounted onto a stiffener to make a mono-block connector. Backplane headers are available in lengths of 10 and 25 columns; open and guide pin versions are available. Optional freestanding guide pins are available. These robust guide pins mount directly into the backplane PCB to accommodate heavier daughtercards.
Cable assembly designs accommodate multi-wafer and custom back-shell solutions. In-house test equipment can verify design goals through Time Domain Reflectrometry TDR and impedance profile analysis.