连接器
mpact™ Backplane Connector and Cable Assembly System
Pushing the density envelope to meet next generation high-speed demands, the Impact™ backplane system features superior electrical performance up to and beyond 25 Gbps with one of the most versatile offerings in the market. Over the past decade, data rates have increased pushing datacom equipment developers to release faster architectures. As a result, OEMs are upgrading line cards in their existing infrastructures and developing new platforms. The Impact Backplane Connector System addresses these needs for fast, electrically clean, dense and flexible connectors in high-performance systems.
’s Impact™ Backplane Connector System provides data rates up to and beyond 25 Gbps along with superior signal density up to 30 pairs per cm 80 differential pairs per inch. The broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system.
Impact™ 85 Ohm Plus leverages the 100 Ohm technology, density and footprint that offers an electrically enhanced solution with the addition of a plus clip which improves common mode performance.
Impact™ Orthogonal Direct eliminates the midplane, enabling customers to reduce cost, improve electrical performance and remove thermal barriers.
Impact™ Orthogonal Midplane reduces channel lengths and midplace complexity and costs. Daughtercards can be vertically mated on one side of the midplane and horizontally on the other.
Impact™ Power is offered in 3- through 6-pair sizes in conventional, coplanar and mezzanine configurations, with current ratings from 60.0 to 120.0A per module.
The soon-to-be-released addition of the 28 Gbps zX2 headers and receptacles allow current Impact customers to keep their existing architecture in place while upgrading their chassis’ data rates.