860-60G

HEAT TRANS COMPOUND SILICONE

Heat Transfer Compound, 400 V/MIL Dielectric Strength, 2.3 Specific Gravity

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.

* MIL-DTL-47113D