908-35-1-12-2-B-0

WAKEFIELD SOLUTIONS  908-35-1-12-2-B-0  散热器, 用于芯片组, 11.1 °C/W

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEATSINK 35X35X12MM ELLIPTICAL

贸泽:
Heat Sinks CHIPSET HS ELIPTICAL 35mm 11.6mm H B/A

e络盟:
散热器, 用于芯片组, 11.1 °C/W

Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 35 x 11.6 mm

Verical:
Elliptical Fin Heat Sink

Newark:
# WAKEFIELD SOLUTIONS  908-35-1-12-2-B-0  Heat Sink, Square, Chipset, 11.1 °C/W, 11.6 mm, 35 mm, 35 mm