904-27-2-23-2-B-0

WAKEFIELD SOLUTIONS  904-27-2-23-2-B-0  散热器, 用于芯片组, 9.44 °C/W

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEATSINK 27X27X23MM PIN

e络盟:
散热器, 用于芯片组, 9.44 °C/W

Allied Electronics:
Heatsink; Fin Pin with clip assembly; 27 x 22.6 mm

Verical:
904-27-2-23-2-B-0

Newark:
# WAKEFIELD SOLUTIONS  904-27-2-23-2-B-0  Heat Sink, Square, Chipset, 9.44 °C/W, 22.6 mm, 27 mm, 27 mm