Res Thick Film 2512 182KΩ 1% 1W ±100ppm/℃ Molded SMD SMD Blister T/R
* Stability R/R = 1 % for 1000 h at 70 ° C * 2 mm pitch packaging option for 0603 size * Pure tin solder contacts on Ni barrier layer provides compatibility with lead Pb-free and lead containing soldering processes * Metal glaze on high quality ceramic * AEC-Q200 qualified * Size 2512
安富利:
Res Thick Film 2512 182K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Blister T/R