RES Thick Film 2512 0.01Ω 100% 5M11 R67 SMD
* Stability R/R = 1 % for 1000 h at 70 ° C * 2 mm pitch packaging option for 0603 size * Pure tin solder contacts on Ni barrier layer provides compatibility with lead Pb-free and lead containing soldering processes * Metal glaze on high quality ceramic * AEC-Q200 qualified * Size 2512
安富利:
RES THKFLM 2512 0.01 OHM 100% 5M11 R67 SMD