3.00毫米( 0.118 “ )间距微飞度3.0 BMI ™接头,表面安装,双排,垂直,与PCB偏光PEG, 14电路,锡(Sn )镀层 3.00mm .118" Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, Tin Sn Plating
针座 通孔 14 位置 0.118"(3.00mm)
得捷:
CONN HEADER VERT 14POS 3MM
安富利:
Conn Wire to Board HDR 14 POS 3mm Solder ST Thru-Hole Tray