2.54毫米（ .100“ ）间距C- Grid®头，低调，双排，垂直，带罩， 30Circuits ， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层 2.54mm .100" Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm 15μ" Gold Au Selective Plating, Tin Sn PC Tail Plating
Connector Header Through Hole 30 position 0.100" 2.54mm
得捷:
CONN HEADER VERT 30POS 2.54MM
安富利:
Conn Shrouded Header HDR 30 POS 2.54mm Solder ST Thru-Hole Tray