触点材质 Beryllium Copper
工作温度 -55℃ ~ 125℃
Termination Method Solder
Contact Material Beryllium Copper
Housing Material Liquid Crystal Polymer
Pitch 1 mm
Max Processing Temp 260
Contact Plating Gold Over Nickel
Lead Finish Gold
Gender HDR
Operating Temperature -55 to 125 °C
Mounting Surface Mount
Body Orientation Straight
Product Length 10.76 mm
RoHS标准 RoHS Compliant