触点材质 Beryllium Copper
工作温度 -55℃ ~ 125℃
Max Processing Temp 260
Gender HDR
MSL Level 1
Housing Material Liquid Crystal Polymer
Pitch 1 mm
Mounting Surface Mount
Body Orientation Straight
Termination Method Solder
Product Dimensions 15.76 x 8.76 x 3.89 mm
Operating Temperature -55 to 125 °C
Contact Plating Gold Over Nickel
Contact Material Beryllium Copper
Lead Finish Gold
Product Length 15.76 mm
RoHS标准 RoHS Compliant