触点材质 Beryllium Copper
工作温度 -55℃ ~ 125℃
Mounting Surface Mount
MSL Level 1
Body Orientation Straight
Contact Plating Gold Over Nickel
Termination Method Solder
Product Length 15.76 mm
Pitch 1.0000 mm
Product Dimensions 15.76 x 8.76 x 4.4 mm
Max Processing Temp 260
Base/Housing Material Liquid Crystal Polymer
Gender HDR
Lead Finish Gold
Contact Material Beryllium Copper
Operating Temperature -55 to 125 °C
ECCN EAR99
SCHEDULE B 8536.69.40.40
HTSN 8536.69.40.40