电容 0.001 µF
封装 1206
封装 1206
工作温度 -55℃ ~ 125℃
Product Dimensions 3.2 x 1.6 x 1.3
MSL Level 1
Case Size 1206
Dielectric BP
Tolerance 5 %
Military Standard MIL-PRF-55681/8
Construction Flat
VoltageDC 100 V
Operating Temperature -55 to 125 °C
Mounting Surface Mount
Failure Rate P
Product Length 3.2 mm
Lead Finish Tin/Lead
Case Style Ceramic Chip
Capacitance Value 0.001 uF
Max Processing Temp 235 to 260|260
ECCN EAR99
SCHEDULE B 8532240020
HTSN 8532240020
Country Of Origin Israel