电容 22 pF
封装 1206
封装 1206
工作温度 -55℃ ~ 125℃
Military Standard MIL-PRF-55681/8
Case Size 1206
Case Style Ceramic Chip
Max Processing Temp 235 to 260|260
Tolerance 1 %
Failure Rate S
Construction Flat
MSL Level 1
Product Dimensions 3.2 x 1.6 x 1.3
Mounting Surface Mount
Product Length 3.2 mm
Dielectric BP
Capacitance Value 22 pF
Lead Finish Tin/Lead
VoltageDC 100 V
Operating Temperature -55 to 125 °C
ECCN EAR99
SCHEDULE B 8532240020
HTSN 8532240020