

0402 90.9kΩ ±1% ±200ppm/℃
* High resistance to sulfurization achieved by adopting an Ag-Pd-based inner electrode * High reliability * Metal glaze thick film resistive element and three layers of electrodes * Suitable for both reflow and flow soldering * Low Resistance type ERJU6S, U6Q : 0.1 Ω to 1.0 Ω * Reference Standard: IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B * AEC-Q200 qualified Exemption ERJU01 * RoHS compliant * Power Rating: 0.1 W
安富利:
Res Thick Film 0402 90.9K Ohm 1% 1/10W ±200ppm/°C Molded SMD Punched Carrier T/R