2.54毫米( .100 )间距C- Grid®头,表面贴装,双排,垂直, 14电路, 0.38μm ( 15μ ),金(Au )镀层,具有拾取和放置盖,用PEG ,磁带和卷轴 2.54mm .100 Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm 15μ Gold Au Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
针座 表面贴装型 14 位置 0.100"(2.54mm)