BGU8004Z

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BGU8004Z概述

RF Amp Chip Single GP 1610MHz 3.1V 6Pin WLCSP

Overview

The BGU8004 is a Low Noise Amplifier LNA for GNSS receiver applications. It comes as extremely small and thin Wafer Level Chip Scale Package WLCSP. The BGU8004 requires one external matching inductor.

The BGU8004 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption with optimised performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 17 dB gain at a noise figure of 0.60 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity.

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## Features

* Covers full GNSS L1 band, from 1559 MHz to 1610 MHz

* Noise figure NF = 0.60 dB

* Gain 17.0 dB

* High input 1 dB compression point of -7.5 dBm

* High out of band IP3i of 6 dBm

* Supply voltage 1.5 V to 3.1 V

* Optimized performance at very low 3.4 mA supply current

* Power-down mode current consumption < 1 μA

* Integrated temperature stabilized bias for easy design

* Requires only one input matching inductor

* Input and output DC decoupled

* ESD protection on all pins HBM > 2 kV

* Integrated matching for the output

* Extremely small Wafer Level Chip Scale Package WLCSP 0.65 mm x 0.44 mm x 0.2 mm; 6 solder bumps; 0.22 mm bump pitch

* 180 GHz transit frequency - SiGe:C technology

## Target Applications

* LNA for GPS, GLONASS, Galileo and Compass BeiDou in smart phones, feature phones, tablet, digital still cameras, digital video cameras, RF front-end modules, complete GNSS modules and personal health applications

## Features

* LNA for GPS, GLONASS, Galileo and Compass BeiDou in smart phones, feature phones, tablet, digital still cameras, digital video cameras, RF front-end modules, complete GNSS modules and personal health applications

BGU8004Z中文资料参数规格
技术参数

频率 1.559GHz ~ 1.61GHz

供电电流 7.5 mA

增益 19 dB

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压 1.5V ~ 3.1V

封装参数

引脚数 6

封装 XFBGA-6

外形尺寸

高度 0.32 mm

封装 XFBGA-6

物理参数

工作温度 -40℃ ~ 85℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

在线购买BGU8004Z
型号: BGU8004Z
制造商: NXP 恩智浦
描述:RF Amp Chip Single GP 1610MHz 3.1V 6Pin WLCSP

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