BDN17-3CB/A01概述
Heat Sink Passive BGA/PGA/PLCC/QFP Extruded Adhesive 11.5℃/W Aluminum Black Anodized
散热片 分类（BGA，LGA，CPU，ASIC……） 铝 - 顶部安装
得捷:
HEATSINK CPU W/ADHESIVE 1.71"SQ
艾睿:
Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 11.5°C/W Black Anodized
安富利:
Heat Sink Passive BGA/PGA/PLCC/QFP Extruded Adhesive 11.5°C/W Aluminum Black Anodized
AMEYA360:
HEATSINK CPU W/ADHESIVE 1.71SQ