TEXAS INSTRUMENTS CC2564MODNCMOET 芯片, 蓝牙, 4.1版, 2402-2480MHZ
The CC2564MODN Bluetooth HCI module is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI"s seventh-generation Bluetooth core, the HCI module provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit MCU, the HCI module provides best-in-class RF performance. TI"s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions.
频率 2.4 GHz
电源电压DC 2.20V min
时钟频率 2.40 GHz
数据速率 4.00 Mbps
输出功率 10 dBm
待机电流 40.0 µA
工作温度Max 70 ℃
工作温度Min -20 ℃
电源电压 2.2V ~ 4.8V
电源电压Max 4.8 V
电源电压Min 2.2 V
安装方式 Surface Mount
引脚数 33
封装 SMD-33
封装 SMD-33
工作温度 -30℃ ~ 85℃
产品生命周期 Active
包装方式 Tape & Reel TR
RoHS标准 Non-Compliant
含铅标准 Contains Lead
REACH SVHC标准 No SVHC
REACH SVHC版本 2015/06/15
ECCN代码 5A992C
香港进出口证 NLR
型号/品牌 | 代替类型 | 替代型号对比 |
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CC2564MODNCMOET TI 德州仪器 | 当前型号 | 当前型号 |
CC2564MODNCMOER 德州仪器 | 类似代替 | CC2564MODNCMOET和CC2564MODNCMOER的区别 |