Samsung 0805 MLCC seriesGeneral Multilayer Ceramic Chip CapacitorsHighly reliable tolerance and high speed automatic chip placement on PCBs Wide capacitance range Wide temperature compensation and voltage range: from C0G to Y5V and from 6.3V to 50V Highly reliable performance Highly resistant termination metal Applications include: HHP, DSC, DVC, LCD, TV, Memory Module, PDA, Game Machine; Tuner Product code C is suitable. For using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification ### 0805 系列镍挡层端接外覆镀锡 NiSn 层。应用包括移动电话、视频和调谐器设计,COG/NPO 是最受欢迎的温度补偿方案,EIA I 级陶瓷材料、X7R、X5R 方案称为温度稳定陶瓷且使用 EIA II 级材料;Y5V、Z5U 方案通用于有限温度范围,EIA II 级材料;这些特性十分适用于去耦应用。
0805 MLCC series
General Multilayer Ceramic Chip Capacitors
Highly reliable tolerance and high speed automatic chip placement on PCBs
Wide capacitance range
Wide temperature compensation and voltage range: from C0G to Y5V and from 6.3V to 50V
Highly reliable performance
Highly resistant termination metal
Applications include: HHP, DSC, DVC, LCD, TV, Memory Module, PDA, Game Machine;
Tuner Product code C is suitable.
For using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification
### 0805 系列
镍挡层端接外覆镀锡 NiSn 层。应用包括移动电话、视频和调谐器设计,COG/NPO 是最受欢迎的温度补偿方案,EIA I 级陶瓷材料、X7R、X5R 方案称为温度稳定陶瓷且使用 EIA II 级材料;Y5V、Z5U 方案通用于有限温度范围,EIA II 级材料;这些特性十分适用于去耦应用。
额定电压DC 10.0 V
电容 10 µF
容差 ±10 %
电介质特性 X5R
工作温度Max 85 ℃
工作温度Min -55 ℃
额定电压 10 V
安装方式 Surface Mount
封装公制 2012
封装 0805
长度 2 mm
宽度 1.25 mm
高度 1.25 mm
封装公制 2012
封装 0805
厚度 1.25 mm
材质 X5R/-55℃~+85℃
工作温度 -55℃ ~ 85℃
温度系数 ±15 %
产品生命周期 Active
包装方式 Tape & Reel TR
最小包装 2000
制造应用 通用
RoHS标准 RoHS Compliant
含铅标准 Lead Free
军工级 Yes
ECCN代码 EAR99
型号/品牌 | 代替类型 | 替代型号对比 |
---|---|---|
CL21A106KPFNNNF Samsung 三星 | 当前型号 | 当前型号 |
CL21A106KPFNNNE 三星 | 完全替代 | CL21A106KPFNNNF和CL21A106KPFNNNE的区别 |
LMK212BJ106KD-T 太诱 | 类似代替 | CL21A106KPFNNNF和LMK212BJ106KD-T的区别 |
LMK212BJ106KG-T 太诱 | 类似代替 | CL21A106KPFNNNF和LMK212BJ106KG-T的区别 |