CC2564MODACMOG

CC2564MODACMOG图片1
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CC2564MODACMOG概述

具有基本速率、增强数据速率和带集成天线的低功耗模块的 Bluetooth® 4.1 35-QFM -30 to 85

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes "s seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI"s MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI"s third party. The iPod® MFi protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI"s wireless-connectivity/dual-mode-bluetooth page.

CC2564MODACMOG中文资料参数规格
技术参数

频率 2.4 GHz

时钟频率 2.40 GHz

输出功率 10 dBm

待机电流 40.0 µA

工作温度Max 85 ℃

工作温度Min -30 ℃

电源电压 2.2V ~ 4.8V

封装参数

安装方式 Surface Mount

引脚数 35

封装 SMD-33

外形尺寸

封装 SMD-33

物理参数

工作温度 -30℃ ~ 85℃

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

数据手册

CC2564MODACMOG引脚图与封装图
CC2564MODACMOG引脚图
CC2564MODACMOG封装图
CC2564MODACMOG封装焊盘图
在线购买CC2564MODACMOG
型号: CC2564MODACMOG
制造商: TI 德州仪器
描述:具有基本速率、增强数据速率和带集成天线的低功耗模块的 Bluetooth® 4.1 35-QFM -30 to 85

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