C1S 2.5

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C1S 2.5概述

Fuse Chip Slow Blow Acting 2.5A 63V SMD Solder Pad 1206 Ceramic

* Slow Blow * Small size, 1206 SMD * Current rating from 750mA to 5A * Wide operating temperature range from -55°C to 125°C * Tape & Reel for automatic SMD placement * Compatible with reflow and wave soldering * RoHS 6 compliant MSL =1 * Halogen Fee * Leadfree


艾睿:
A great alternative to a circuit breaker, this a chip C1S 2.5 fuse from Bel Fuse will protect your electronics. Its maximum power dissipation is 0.43Nom W. This device has a maximum power dissipation of 0.43Nom W. This device has a current rating of 2.5. This fuse has a minimum operating temperature of -55 °C and a maximum of 125 °C. It has 2 terminals. The C1S 2.5 fuse has a solder pad termination style. Mount your fuse on a printed circuit board using surface mount technology to produce the most effective results. Its fuse is made from ceramic. The maximum AC voltage rating is 63 VAC and the maximum DC voltage rating is 63 VDC. This product is 3.2 mm long, 0.58 mm tall and 1.52 mm deep.


安富利:
Fuse Chip 2.5A 63V Slow Blow 2-Pin Solder Pad Surface Mount


Chip1Stop:
Fuse Chip Slow Blow Acting 2.5A 63V SMD Solder Pad 1206 Ceramic


Verical:
Fuse Chip Slow Blow Acting 2.5A 63V SMD Solder Pad 1206 Ceramic CE/cULus


C1S 2.5中文资料参数规格
技术参数

额定电压DC 63 V

额定电压AC 63 V

额定电流 2.5 A

耗散功率 0.43NOMW

电阻 0.072 Ω

工作温度Max 125 ℃

工作温度Min -55 ℃

额定电压 63 V

额定电压DC Max 63 V

额定电压AC Max 63 V

封装参数

安装方式 Surface Mount

引脚数 2

封装公制 3216

封装 1206

外形尺寸

长度 3.2 mm

宽度 1.58 mm

高度 0.58 mm

封装公制 3216

封装 1206

物理参数

工作温度 -55℃ ~ 125℃

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

C1S 2.5引脚图与封装图
C1S 2.5引脚图
C1S 2.5封装图
C1S 2.5封装焊盘图
在线购买C1S 2.5
型号: C1S 2.5
描述:Fuse Chip Slow Blow Acting 2.5A 63V SMD Solder Pad 1206 Ceramic

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