Samsung 0805 MLCC seriesGeneral Multilayer Ceramic Chip CapacitorsHighly reliable tolerance and high speed automatic chip placement on PCBs Wide capacitance range Wide temperature compensation and voltage range: from C0G to Y5V and from 6.3V to 50V Highly reliable performance Highly resistant termination metal Applications include: HHP, DSC, DVC, LCD, TV, Memory Module, PDA, Game Machine; Tuner Product code C is suitable. For using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification ### 0805 系列镍挡板终端覆镀锡 NiSn 层,应用包括移动电话、视频和调谐器设计,COG/NPO 是温度补偿的最常见配方,为 EIA I 类陶瓷材料,X7R、X5R 配方称为温度稳定陶瓷,属于 EIA II 类材料,Y5V、Z5U 配方适合有限温度范围内的一般用途,属于 EIA II 类材料;这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途,属于 EIA II 类材料;这些特征非常适合退耦应用。
0805 MLCC series
General Multilayer Ceramic Chip Capacitors
Highly reliable tolerance and high speed automatic chip placement on PCBs
Wide capacitance range
Wide temperature compensation and voltage range: from C0G to Y5V and from 6.3V to 50V
Highly reliable performance
Highly resistant termination metal
Applications include: HHP, DSC, DVC, LCD, TV, Memory Module, PDA, Game Machine;
Tuner Product code C is suitable.
For using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification
### 0805 系列
镍挡层端接外覆镀锡 NiSn 层。应用包括移动电话、视频和调谐器设计,COG/NPO 是最受欢迎的温度补偿方案,EIA I 级陶瓷材料、X7R、X5R 方案称为温度稳定陶瓷且使用 EIA II 级材料;Y5V、Z5U 方案通用于有限温度范围,EIA II 级材料;这些特性十分适用于去耦应用。
额定电压DC 6.3 V
工作电压 6.3 V
电容 47 µF
容差 ±20 %
工作温度Max 85 ℃
工作温度Min -55 ℃
额定电压 6.3 V
安装方式 Surface Mount
引脚数 2
封装公制 2012
封装 0805
长度 2 mm
宽度 1.25 mm
高度 1.25 mm
封装公制 2012
封装 0805
材质 X5R/-55℃~+85℃
工作温度 -55℃ ~ 85℃
温度系数 ±15 %
产品生命周期 Active
包装方式 Tape & Reel TR
最小包装 3000
制造应用 通用
RoHS标准 RoHS Compliant
含铅标准 Lead Free
军工级 Yes
ECCN代码 EAR99
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