CY7C1061G30-10BV1XI

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CY7C1061G30-10BV1XI概述

SRAM Chip Async Single 2.5V/3.3V 16M-bit 1M x 16 10ns 48Pin VFBGA

* High speed: tAA = 10 ns/15 ns * Low active and standby currents * Icc = 90-mA typical at 100 MHz * Isb2 = 20-mA typical * Operating voltage range: 1.65 V to 2.2 V, 2.2 V to 3.6 V, and4.5 V to 5.5 V * 1.0-V data retention * Transistor-transistor logic TTL compatible inputs and outputs * Error indication ERR pin to indicate 1-bit error detection andcorrection * Available in Pb-free 48-pin TSOP I, 54-pin TSOP II, and 48-ball VFBGA packages


立创商城:
CY7C1061G30-10BV1XI


得捷:
NO WARRANTY


贸泽:
SRAM 16Mb Fast SRAM With ECC


艾睿:
SRAM Chip Async Single 2.5V/3.3V 16M-bit 1M x 16 10ns 48-Pin VFBGA Tray


安富利:
CY7C1061G is high-performance CMOS fast static RAM devices with embedded ECC. Both devices are offered in single and dual chip enable options and in multiple pin configurations. To access devices with a single chip enable input, assert the chip enable CE\\ input LOW. To access dual chip enable devices, assert both chip enable inputs - CE1\ as LOW and CE2 as HIGH. To perform data writes, assert the Write Enable WE\\ input LOW, and provide the data and address on the device data pins I/O0 through I/O15 and address pins A0 through A19 respectively. The Byte High Enable BHE\\ and Byte Low Enable BLE\\ inputs control byte writes, and write data on the corresponding I/O lines to the memory location specified. BHE\ controls I/O8 through I/O15 and BLE controls I/O0 through I/O7. To perform data reads, assert the Output Enable OE\\ input and provide the required address on the address lines. Read data is accessible on I/O lines I/O0 through I/O15. You can perform byte accesses by asserting the required byte enable signal BHE\ or BLE\\ to read either the upper byte or the lower byte of data from the specified address location. All I/Os I/O0 through I/O15 are placed in a high-impedance state when the device is deselected CE\ HIGH for a single chip enable device and CE1 HIGH / CE2 LOW for a dual chip enable device, or control signals are de-asserted OE\, BLE\, BHE\\.


CY7C1061G30-10BV1XI中文资料参数规格
技术参数

位数 16

存取时间Max 10 ns

工作温度Max 85 ℃

工作温度Min -40 ℃

电源电压 2.2V ~ 3.6V

封装参数

引脚数 48

封装 VFBGA-48

外形尺寸

封装 VFBGA-48

物理参数

工作温度 -40℃ ~ 85℃ TA

其他

产品生命周期 Unknown

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 无铅

海关信息

ECCN代码 3A991.b.2.a

数据手册

在线购买CY7C1061G30-10BV1XI
型号: CY7C1061G30-10BV1XI
描述:SRAM Chip Async Single 2.5V/3.3V 16M-bit 1M x 16 10ns 48Pin VFBGA
替代型号CY7C1061G30-10BV1XI
型号/品牌 代替类型 替代型号对比

CY7C1061G30-10BV1XI

Cypress Semiconductor 赛普拉斯

当前型号

当前型号

CY7C1061DV33-10BV1XI

赛普拉斯

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CY7C1061G30-10BV1XI和CY7C1061DV33-10BV1XI的区别

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