CY7C1362B-166BGC

CY7C1362B-166BGC图片1
CY7C1362B-166BGC概述

9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit 256K x 36/512K x 18 Pipelined SRAM

Functional Description

The CY7C1360B/CY7C1362B SRAM integrates 262,144 x 36 and 524,288 x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input CLK. The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable CE1, depth-expansion Chip Enables CE2and CE3 [2], Burst Control inputs ADSC, ADSP, and ADV, Write Enables BWX, and BWE, and Global Write GW. Asynchronous inputs include the Output Enable OE and the ZZ pin.

Features

• Supports bus operation up to 225 MHz

• Available speed grades are 225, 200 and 166 MHz

• Registered inputs and outputs for pipelined operation

• 3.3V core power supply

• 2.5V/3.3V I/O operation

• Fast clock-to-output times

  — 2.8 ns for 225-MHz device

  — 3.0 ns for 200-MHz device

  — 3.5 ns for 166-MHz device

• Provide high-performance 3-1-1-1 access rate

• User-selectable burst counter supporting Intel Pentium® interleaved or linear burst sequences

• Separate processor and controller address strobes

• Synchronous self-timed writes

• Asynchronous output enable

• Single Cycle Chip Deselect

• Offered in JEDEC-standard 100-pin TQFP, 119-ball BGA and 165-Ball fBGA packages

• TQFP Available with 3-Chip Enable and 2-Chip Enable

• IEEE 1149.1 JTAG-Compatible Boundary Scan

• “ZZ” Sleep Mode Option

CY7C1362B-166BGC中文资料参数规格
技术参数

电源电压DC 3.30 V, 3.60 V max

时钟频率 166MHz max

存取时间 166 µs

内存容量 9000000 B

工作温度Max 70 ℃

工作温度Min 0 ℃

电源电压 3.135V ~ 3.6V

封装参数

安装方式 Surface Mount

引脚数 119

封装 BGA-119

外形尺寸

高度 1.46 mm

封装 BGA-119

物理参数

工作温度 0℃ ~ 70℃

其他

产品生命周期 Unknown

包装方式 Bulk

符合标准

RoHS标准

含铅标准

数据手册

在线购买CY7C1362B-166BGC
型号: CY7C1362B-166BGC
描述:9兆位( 256K ×36 / 512K ×18 )流水线式SRAM 9-Mbit 256K x 36/512K x 18 Pipelined SRAM

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