CCI08

CCI  CCI08  散热器, BGA, FPGA, 双面胶, BGA, 9.51 °C/W, 9 mm, 28 mm, 28 mm

The 08 is a Heat Sink made of aluminium typically used with DSP, FPGAs and other electronics BGA packages. It is also suitable for variety of applications requiring simple extension of surface area for cooling. The double sided adhesive provides simple and effective attachment.

e络盟:
CCI  CCI08  散热器, BGA, FPGA, 双面胶, BGA, 9.51 °C/W, 9 mm, 28 mm, 28 mm

Newark:
# CCI  CCI08  Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.51 C/W, 9 mm, 28 mm, 28 mm