DS1230AB-70

DS1230AB-70图片1
DS1230AB-70图片2
DS1230AB-70图片3
DS1230AB-70概述

IC NVSRAM 256Kbit 70NS 28DIP

DESCRIPTION

The DS1230 256k Nonvolatile SRAMs are 262,144-bit, fully static, nonvolatile SRAMs organized as 32,768 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry which constantly monitors VCC for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is automatically switched on and write protection is unconditionally enabled to prevent data corruption. DIP-package DS1230 devices can be used in place of existing 32k x 8 static RAMs directly conforming to the popular bytewide 28-pin DIP standard. The DIP devices also match the pinout of 28256 EEPROMs, allowing direct substitution while enhancing performance. DS1230 devices in the Low Profile Module package are specifically designed for surface-mount applications. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing.

FEATURES

■ 10 years minimum data retention in the absence of external power

■ Data is automatically protected during power loss

■ Replaces 32k x 8 volatile static RAM, EEPROM or Flash memory

■ Unlimited write cycles

■ Low-power CMOS

■ Read and write access times of 70 ns

■ Lithium energy source is electrically disconnected to retain freshness until power is applied for the first time

■ Full ±10% VCC operating range DS1230Y

■ Optional ±5% VCC operating range DS1230AB

■ Optional industrial temperature range of -40°C to +85°C, designated IND

■ JEDEC standard 28-pin DIP package

■ PowerCap Module PCM package

   - Directly surface-mountable module

   - Replaceable snap-on PowerCap provides lithium backup battery

   - Standardized pinout for all nonvolatile SRAM products

   - Detachment feature on PowerCap allows easy removal using a regular screwdriver

DS1230AB-70中文资料参数规格
技术参数

电源电压DC 5.00 V, 5.25 V max

时钟频率 70.0 GHz

存取时间 70.0 ns

内存容量 32000 B

电源电压 4.75V ~ 5.25V

封装参数

安装方式 Through Hole

引脚数 28

封装 DIP-28

外形尺寸

封装 DIP-28

物理参数

工作温度 0℃ ~ 70℃ TA

其他

产品生命周期 Unknown

包装方式 Tube

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

DS1230AB-70引脚图与封装图
DS1230AB-70引脚图
DS1230AB-70封装图
DS1230AB-70封装焊盘图
在线购买DS1230AB-70
型号: DS1230AB-70
描述:IC NVSRAM 256Kbit 70NS 28DIP
替代型号DS1230AB-70
型号/品牌 代替类型 替代型号对比

DS1230AB-70

Maxim Integrated 美信

当前型号

当前型号

DS1230AB-70+

美信

类似代替

DS1230AB-70和DS1230AB-70+的区别

DS1230Y-70IND

美信

类似代替

DS1230AB-70和DS1230Y-70IND的区别

DS1230AB-70IND

美信

类似代替

DS1230AB-70和DS1230AB-70IND的区别

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