Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Summary of Features:
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High Speed IGBT H3
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Low Switching Losses
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Fast Silicon diode 1200V
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Al2O3 Substrate with Low Thermal Resistance
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Integrated NTC temperature sensor
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PressFIT Contact Technology
Benefits:
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Compact module concept
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Optimized customer’s development cycle time and cost
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Configuration flexibility