DF80R12W2H3FB11BPSA1

DF80R12W2H3FB11BPSA1图片1
DF80R12W2H3FB11BPSA1概述

Fast and solder-less assembly is possible using our EasyPACK™ 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3 .

Summary of Features:

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High Speed IGBT H3
.
Low Switching Losses
.
CoolSiC™ Schottky diode 1200V
.
Al2O3 Substrate with Low Thermal Resistance
.
Integrated NTC temperature sensor
.
PressFIT Contact Technology

Benefits:

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Compact module concept
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Optimized customer’s development cycle time and cost
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Configuration flexibility
DF80R12W2H3FB11BPSA1中文资料参数规格
技术参数

击穿电压集电极-发射极 1200 V

输入电容Cies 2.35nF @25V

额定功率Max 20 mW

封装参数

封装 AG-EASY2B-2

外形尺寸

封装 AG-EASY2B-2

物理参数

工作温度 -40℃ ~ 150℃ TJ

其他

产品生命周期 Active

包装方式 Tray

制造应用 Solar

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

DF80R12W2H3FB11BPSA1引脚图与封装图
DF80R12W2H3FB11BPSA1电路图
在线购买DF80R12W2H3FB11BPSA1
型号: DF80R12W2H3FB11BPSA1
描述:Fast and solder-less assembly is possible using our EasyPACK™ 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3 .

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