蓝牙?射频模块 BLUETOOTH? RF MODULES
PAN1325 Host Controlled Interface HCI Bluetooth RF module brings Texas Instrument"s seventh generation Bluetooth core integrated circuit, the CC2560, to an easy to use module format. Its tiny footprint technology has produced a module of only 85.5mm². The module is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing.
频率 2.4 GHz
数据速率 2.18 Mbps
输出功率 10.5 dBm
工作温度Max 70 ℃
工作温度Min -20 ℃
电源电压 1.7V ~ 4.8V
电源电压Max 4.8 V
电源电压Min 1.7 V
安装方式 Surface Mount
引脚数 28
封装 SMD
长度 9.5 mm
宽度 9 mm
高度 1.8 mm
封装 SMD
工作温度 -20℃ ~ 70℃
产品生命周期 Unknown
包装方式 Tape & Reel TR
制造应用 Building Automation, Industrial, Automation & Process Control, Sensing & Instrumentation, RF Communications
RoHS标准 RoHS Compliant
含铅标准 Lead Free
REACH SVHC标准 No SVHC
REACH SVHC版本 2015/06/15
型号/品牌 | 代替类型 | 替代型号对比 |
---|---|---|
ENW-89829A2JF Panasonic 松下 | 当前型号 | 当前型号 |