EX-Z12FA

光电传感器, EX-Z 系列, 超小型, 投射光, 200 mm, NPN, 有光开启, 前端感应

The is part of the EX-Z series, which utilises new semiconductor packaging technology that does not use wire bonding to produce one of the thinnest packages available. The small unit size allows installation of sensors in a narrow space where only a conventional fibre sensor head could be installed before. The built-in amplifier also saves on installation space

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Ultra minute

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Built in amplifier

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Small object sensing capability

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Suitable for a wide range of applications