F3L15R12W2H3_B27概述
EasyPACK™ 2B 1200V 3-level NPC2 full-bridge IGBT module with NTC, High Speed IGBT H3 and PressFIT Contact Technology
Summary of Features:
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- Low inductive design
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- Low Switching Losses
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- Low VCEsat
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- Al2O3 Substrate with Low Thermal Resistance
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- Compact design
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- PressFIT Contact Technology
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- Rugged mounting due to integrated mounting clamps
Benefits:
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- Compact module concept
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- Optimized customer’s development cycle time and cost
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- Configuration flexibility
F3L15R12W2H3_B27中文资料参数规格
F3L15R12W2H3_B27引脚图与封装图 
在线购买F3L15R12W2H3_B27
型号： F3L15R12W2H3_B27
制造商：
Infineon
英飞凌
描述：EasyPACK™ 2B 1200V 3-level NPC2 full-bridge IGBT module with NTC, High Speed IGBT H3 and PressFIT Contact Technology