SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE 8Mbit 1024K x 8, 16Mbit 2056K x 8 FLASH MEMORY FAMILY
Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V VPP Fast Production
Programming
2.7V or 1.8V I/O Option
Reduces Overall System Power
Optimized Block Sizes
Eight 8-Kbyte Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 64-Kbyte Blocks
for Code
High Performance
2.7V–3.6V: 120 ns Max Access Time
Block Locking
VCC-Level Control through WP#
Low Power Consumption
20 mA Maximum Read Current
Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
Extended Temperature Operation
–40°C to +85°C
Supports Code plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
Extended Cycling Capability
10,000 Block Erase Cycles
Automated Byte Program and Block
Erase
Command User Interface
Status Registers
SRAM-Compatible Write Interface
Automatic Power Savings Feature
Reset/Deep Power-Down
1 µA ICCTypical
Spurious Write Lockout
Standard Surface Mount Packaging
48-Ball µBGA 40-Lead TSOP Package
Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
ETOX™ V 0.4 µ Flash Technology
x8-Only Input/Output Architecture
For Space-Constrained 8-bit
Applications
Category Integrated Circuits ICs>Embedded - Microprocessors
Mfr Intel
Package Bulk
RoHS Status RoHS non-compliant
MSL Level 3 168 Hours
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.32.0071
Other Names INTINTGT28F008B3T120,2156-GT28F008B3T120
Standard Package 2,000
Win Source Part Number 1058153-GT28F008B3T120
Fake Threat In the Open Market 68 pct.
Alternative Parts Cross-Reference GT28F008B3T120GT28F008B3-T120;