IRF3710SPBF

MOSFET, Power; N-Ch; VDSS 100V; RDSON 23Milliohms; ID 57A; D2Pak; PD 200W; VGS +/-20

Advanced HEXFET® Power MOSFETs from utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version IRF3710L is available for low-profile applications.

**Features:**

* Advanced Process Technology

* Ultra Low On-Resistance

* Dynamic dv/dt Rating

* 175°C Operating Temperature

* Fast Switching

* Fully Avalanche Rated

* Lead-Free