ICK BGA 27 X 27 X 10

FISCHER ELEKTRONIK  ICK BGA 27 X 27 X 10  散热器, 方形, 电路板, 用于球栅阵列, BGA, 18.5 °C/W, 10 mm, 27 mm, 27 mm

The is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.

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Universal socket

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3.3W Dissipation loss Pv

e络盟:
FISCHER ELEKTRONIK  ICK BGA 27 X 27 X 10  散热器, 方形, 电路板, 用于球栅阵列, BGA, 18.5 °C/W, 10 mm, 27 mm, 27 mm

安富利:
Heat Sink Passive BGA Pin Array 18.5°C/W Aluminum Alloy Black Anodized

TME:
Heatsink: extruded; black; L:27mm; W:27mm; H:10mm; aluminium

Newark:
# FISCHER ELEKTRONIK  ICK BGA 27 X 27 X 10  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 18.5 °C/W, 10 mm, 27 mm, 27 mm