| Family(逻辑族) |
中英文大意 |
Prefix(前缀) |
| ANA |
U |
|
| BGA |
Ball Grid Array（球栅阵列封装） |
U |
| BPF |
U |
|
| BQF |
U |
|
| CAP |
CAPACITOR（电容器） |
C |
| CFP |
CFP(陶瓷扁平封装) |
U |
| CLC |
U |
|
| CMO |
U |
|
| CON |
CONIN（连接器）CON接口 |
J |
| CQF |
U |
|
| DIO |
DIODE(二极管） |
D |
| DIP |
Dual In-line Package(双列直插组件) |
U |
| ECL |
U |
|
| EDG |
P |
|
| FUS |
FUSE(保险丝)> |
F |
| HMO |
|
U |
| HOL |
|
X |
| IND |
INDUCTANCE（电感） |
L |
| LCC |
Leadless chip carrier（无引脚片式载体） |
U |
| MOS |
Metal Oxide Semiconductor（金属氧化物半导体） |
U |
| OSC |
Open Source Commerce（振荡器） |
Y |
| PFP |
|
U |
| PGA |
butt joint pin grid array碰焊 (pin grid array) |
U |
| PLC |
|
U |
| POT |
POTENTIOMETER（可变电阻器） |
P |
| PQF |
|
U |
| PSO |
|
U |
| QFJ |
CLCC(ceramic leaded chip carrier)也称QFJ,QFJ-G |
U |
| QFP |
Quad flat package(四侧引脚扁平封装) |
U |
| QSO |
|
U |
| RES |
Resistor（电阻器） |
R |
| RLY |
RLY（继电器） |
K |
| SCR |
Silicon Controlled Rectifier（可控硅） |
SC |
| SKT |
|
U |
| SOI |
small out-line I-leaded package(I形引脚小外型封装) |
U |
| SOJ |
Small Out-Line J-Leaded Package(J形引脚小外型封装) |
U |
| SOP |
Small Out-Line package(小外形封装) |
U |
| SSO |
|
U |
| SWI |
SWITCH（开关） |
S |
| TQF |
|
U |
| TRX |
Transistor(三极管） |
Q |
| TSO |
|
U |
| TTL |
Transistor-Transistor Logic(BJT-BJT逻辑门） |
U |
| VSO |
|
U |
| XFR |
XFMR（变压器） |
T |
| ZEN |
ZENER（齐纳二极管） |
Z |
| UND |
|
|
| SIP |
Single in-line package（直插式组件） |
U |
|
|
Photoelectric coupler(光电耦合器） |
U/N |
| LED |
Light Emitting Diode（发光二极管） |
LED |
| TVS |
Transient Voltage Suppressor(瞬态电压抑制二极管) |
TVS |
| FB |
Ferrite bead(磁珠) |
FB |
| TP |
TEST POINT(测试点） |
TP |
| MIC |
MICROPHONE (麦克风) |
MIC |
| BQFP |
BQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装 |
U |
| CLCC |
Ceramic leaded chip carrier(带引脚的陶瓷芯片载体) |
U |
| COB |
Chip on board(板上芯片封装) |
U |
| DFP |
Dual flat package(双侧引脚扁平封装)(是SOP 的别称) |
U |
| FP |
Flat package(扁平封装) |
U |
| FQFP |
Fine pitch quad flat package(小引脚中心距QFP) |
U |
| CQFP |
Quad fiat package with guard ring(带保护环的四侧引脚扁平封装 |
U |
| HSOP |
H-(with heat sink)HSOP 表示带散热SOP |
U |
| LQFP |
Low profile quad flat package(薄型QFP) |
U |
| SMD |
Surface mount devices(表面贴装器件) |
U |
| CPGA |
Ceramic Pin Grid Array |
U |
| ZIP |
Zig-Zag Inline Package （之字型直插式封装） |
U |
| TSOP |
Thin Small Outline Package |
U |
| TSSOP |
TSOP II Thin Shrink Outline Package |
U |