BP100-0.005-00-6/6数据手册PDF_BP100-0.005-00-6/6中文资料-锐单商城

BP100-0.005-00-6/6概述

BERGQUIST BP100-0.005-00-6/6 热绝缘, Bond-Ply 100, .005", 6" x 6"板, 碳, 0.8 W/m.K, 3000 V, 0.127 mm, 100000000000 ohm-m

* Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB

.: Thermal impedance: 0.86°C - in²/W @ 100 psi

.: High bond strength to a variety of surfaces

.: Double-sided pressure sensitive adhesive tape

.: High performance, thermally conductive acrylic adhesive

.: Can be used instead of heat cure adhesive, screw mounting or clip mounting

BP100-0.005-00-6/6详细参数

BP100-0.005-00-6/6数据文档

型号	品牌	下载
BP100-0.005-00-6/6	Bergquist	下载
BP104S	Vishay Semiconductor 威世	下载
BP100-0.005-00-12/12	Bergquist	下载
BP10YE	C&K Components	下载
BP10YT	C&K Components	下载
BP10480	TE Connectivity 泰科	下载
BP10-4-T1	BB Battery 美美电池	下载
BP10-12-T2	BB Battery 美美电池	下载
BP10-6-T3	BB Battery 美美电池	下载
BP10-6-T1	BB Battery 美美电池	下载
BP10	Apex Microtechnology	下载