655-53AB数据手册PDF_655-53AB中文资料-锐单商城

655-53AB概述

WAKEFIELD SOLUTIONS 655-53AB 散热器

散热片分类（BGA，LGA，CPU，ASIC……）铝 4.0W @ 40°C 顶部安装

得捷:
HEATSINK CPU 40.6MM SQ H=.525"

贸泽:
散热片 HEATSINK

e络盟:
散热器, 铝质, 黑色, 0.525H x 1.600W x 1.600L

Allied Electronics:
Omnidirectional Pin Fin Heat Sink for 40mm BGA & Power PC

Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Verical:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Newark:
# WAKEFIELD SOLUTIONS 655-53AB Heat Sink, Square, For Ball Grid Arrays, BGA, 13.3 mm, 40.6 mm, 40.6 mm

MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

655-53AB数据文档