L373S-150-0.5数据手册PDF_L373S-150-0.5中文资料-锐单商城

L373S-150-0.5概述

T GLOBAL L373S-150-0.5 空隙填充导热垫, 0.5MM 片状

* Soft material highly compressible, easy to assemble, and provide good electrical insulation

.: Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction

.: Dissipates heat from LEDs, motherboards, PSUs, TVs, PCs, hubs, handsets, memory & hard drives

L373S-150-0.5数据文档