659-65AB

WAKEFIELD SOLUTIONS  659-65AB  散热器, 36.8 X 16.5 X 36.8MM, BGA

散热片 BGA 铝 2.0W @ 20°C 顶部安装

得捷:
HEATSINK EXTRUSION 37MM

e络盟:
WAKEFIELD SOLUTIONS  659-65AB  散热器, 36.8 X 16.5 X 36.8MM, BGA

Allied Electronics:
Unidirectional Fin Heat Sink for 37mm BGA

Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Verical:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Newark:
# WAKEFIELD SOLUTIONS  659-65AB  Heat Sink, Square, For Ball Grid Arrays, BGA, 16.5 mm, 36.8 mm, 36.8 mm

MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized