Res Thick Film 2512 910Ω 5% 1W ±200ppm/℃ Molded SMD SMD Blister T/R
* Stability R/R = 1 % for 1000 h at 70 ° C * 2 mm pitch packaging option for 0603 size * Pure tin solder contacts on Ni barrier layer provides compatibility with lead Pb-free and lead containing soldering processes * Metal glaze on high quality ceramic * AEC-Q200 qualified * Size 2512
艾睿:
Res Thick Film 2512 910 Ohm 5% 1W
Chip1Stop:
Res Thick Film 2512 910 Ohm 5% 1W ±200ppm/℃ SMD Automotive Blister T/R
Verical:
Res Thick Film 2512 910 Ohm 5% 1W ±200ppm/C SMD Automotive T/R
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|---|---|---|
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