658 系列 27.9 x 27.9 x 6.4 mm 5° C/W 热阻 全方向 散热片
散热片 BGA 铝 2.0W @ 40°C 顶部安装
得捷:
HEATSINK CPU 28MM SQ BLK W/TAPE
贸泽:
Heat Sinks 27mm BGA H/S 1.10X.25 w/T412
Allied Electronics:
Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC
Verical:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Newark:
# WAKEFIELD SOLUTIONS 658-25ABT3 Heat Sink, Square, For Ball Grid Arrays, Penguin Cooler, Pin Fin, BGA, 6.4 mm, 27.9 mm, 27.9 mm
MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
| 型号 | 品牌 | 下载 |
|---|---|---|
| 658-25ABT3 | Wakefield Engineering | 下载 |
| 658-25AB | Wakefield Engineering | 下载 |
| 658-60ABT4E | Wakefield Engineering | 下载 |
| 658-35ABT4E | Wakefield Engineering | 下载 |
| 658-45ABT3 | Wakefield Engineering | 下载 |
| 658-45ABT1E | Wakefield Engineering | 下载 |
| 658-45ABT5 | Wakefield Engineering | 下载 |
| 658-60ABT6 | Wakefield Engineering | 下载 |
| 658-25ABT5 | Wakefield Engineering | 下载 |
| 658-35ABT5 | Wakefield Engineering | 下载 |
| 658-35ABT3 | Wakefield Engineering | 下载 |