BDN18-3CB/A01

Heat Sink Passive Pin Array Adhesive Tape 10.8℃/W Black Anodized

* Natural convection is 10.8 * With pre-applied adhesive, just peel off the release liner and press onto the component * Reduces assembly costs; no more messy adhesives or greases required * Excellent mechanical bond * Thermally optimized pin fin * Omnidirectional * Adhesive shear strength at 100°C is 36psi a one inch square heat sink would require a 36lb. force to remove heat sink * Applicable for BGA, PGA, PLCC, and QFP packages

得捷:
HEATSINK CPU W/ADHESIVE 1.81"SQ

艾睿:
Heat Sink Passive Pin Array Adhesive Tape 10.8°C/W Black Anodized

安富利:
Heat Sink Passive Pin Array Adhesive Tape 10.8°C/W Black Anodized

Chip1Stop:
Heat Sink Passive Pin Array Adhesive Tape 10.8ÂÂ℃/W Black Anodized

AMEYA360:
HEATSINK CPU W/ADHESIVE 1.81SQ