BCP68T1

中功率NPN硅高电流晶体管的表面贴装 MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT

集电极-基极反向击穿电压VBRCBOCollector-Base VoltageVCBO| 20V

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集电极-发射极反向击穿电压VBRCEOCollector-Emitter VoltageVCEO| 25V

集电极连续输出电流ICCollector CurrentIC| 1A

截止频率fTTranstion FrequencyfT| 60MHz

直流电流增益hFEDC Current GainhFE| 85~375

管压降VCE（sat）Collector-Emitter Saturation Voltage| 500mV/0.5V

耗散功率PcPower Dissipation| 1.5W

Description & Applications| • High Current: IC = 1.0 Amp • The SOT-223 Package can be soldered using wave or reflow. • SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die • Available in 12 mm Tape and Reel Use to order the 7 inch/1000 unit reel. Use BCP68T3 to order the 13 inch/4000 unit reel. • The PNP Complement is BCP69T1

描述与应用| •高电流IC=1.0安培 •SOT-223包装可以使用波或回流焊接。 •SOT-223包装保证水平安装，从而提高热导通，并允许目视检查焊点。所形成的线索在焊接热应力吸收，消除损害的可能性电路小片 •可在12毫米编带和卷轴 使用BCP68T1到责令7 inch/1000的单位卷轴。 使用BCP68T3责令13 inch/4000的单位卷轴。 •PNP补语是BCP69T1