637-20ABP

637-20ABP概述

WAKEFIELD SOLUTIONS  637-20ABP  散热器, 方形, 黑色阳极氧化, 波焊, TO-220, 9.17 °C/W, 50.8 mm, 34.9 mm, 12.7 mm

Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. 15.9. Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products.


得捷:
HEATSINK TO-220 VERT MT BLK 2"


贸泽:
Heat Sinks TO-220 VERT MT 2"


e络盟:
散热器, 方形, 黑色阳极氧化, 波焊, 9.17 °C/W, TO-220, 34.9 mm, 50.8 mm, 12.7 mm


Allied Electronics:
Heatsink; Vertical Mount; 2 in.; 55C @ 6W; 4.7C/W; Non-RoHS


Newark:
The 637-20ABP is a 50.8 x 34.9 x 12.7mm high-efficiency Heat Sink made of aluminium with black anodized finish. This board level heat sink features wave-solderable pins on 1-inch centre for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied must be minimized.


AMEYA360:
HEATSINK TO-220 VERT MT BLK 2"


Electro Sonic:
Heat Sink Passive TO-220 Solderable Wave Aluminum 4.7 °C/W Black Anodized


637-20ABP数据文档
型号 品牌 下载
637-20ABP

Wakefield Engineering

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637-15ABP

Wakefield Engineering

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637-10ABP

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637-W15-221-012

EDAC 亚得

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637-15ABEP

Wakefield Engineering

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637-026-230-042

EDAC 亚得

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637-015-230-046

EDAC 亚得

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637-026-230-041

EDAC 亚得

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637-026-230-046

EDAC 亚得

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637-W15-222-012

EDAC 亚得

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637-10ABPE

Wakefield Engineering

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