CCI CCI09 散热器, BGA, FPGA, 双面胶, BGA, 9.96 °C/W, 6 mm, 30 mm, 30 mm
The 09 is a 9 x 30 x 30mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.
e络盟:
CCI CCI09 散热器, BGA, FPGA, 双面胶, BGA, 9.96 °C/W, 6 mm, 30 mm, 30 mm
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# CCI CCI09 Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.96 C/W, 6 mm, 30 mm, 30 mm