Heatsink; Eliptical Pin with clip assembly; 37 x 14.6mm
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.
得捷:
HEAT SINK ELLIP FIN 37X37MM CLIP
Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 37 x 14.6 mm
| 型号 | 品牌 | 下载 |
|---|---|---|
| 909-37-1-15-2-B-0 | Wakefield Engineering | 下载 |
| 909-235R BK | Bivar | 下载 |
| 909-235R NT | Bivar | 下载 |
| 909-2131-1 | Bluetechnix | 下载 |
| 909-2145-1 | Bluetechnix | 下载 |
| 909-235 BK | Bivar | 下载 |
| 909-235 NT | Bivar | 下载 |
| 909-06 | PanaVise Products | 下载 |
| 909-10M NC032 | Alpha Wire | 下载 |
| 909-37.5-2-12-2-B-0 | Wakefield Engineering | 下载 |
| 909-37.5-2-23-2-B-0 | Wakefield Engineering | 下载 |